GPU Embedded Computer

14/13/12th Gen Intel® Core™ Series Embedded GPU Computer, Supports 1x MXM 3.1 GPU Expansion Socket

PRODUCTS FEATURES
~Intel® 14/13/12th Gen Core™ i9/i7/i5/i3 Processors (max 65 W TDP)
~Supports 1x MXM 3.1 Type A/B form factor GPU module expansion.
~1x 2.5GbE LAN, 1x 20Gbps USB3.2 Gen2 x2, Type C Connector
~1x M.2 Key M Type 2280 Socket for PCIe Gen4x4 NVMe Storage
~1x M.2 Key E Type 2230 Socket for Wireless/Intel CNVi Module Expansion
~1 x M.2 Key B Type 3052/3042 Socket for 5G/Storage/Add-on Card Expansion
~2 x M.2 Key B Type 2242 Socket for Storage/Add-on Card Expansion
~Optional CMI & CFM Modules for I/O Expansion & Power Ignition Sensing Function
~Wide operating temperature -40°C to 70°C

OVERVIEW
The GM-1100 is a compact and rugged embedded MXM GPU computer for high-performance computing needs. It combines powerful computing and graphics processing capabilities with highly flexible expansion, making it ideal for edge AI applications with limited installation space.

3X Performance boost
Equipped with a 14th generation Intel® Core (Raptor Lake-S Refresh) processor, the GM-1100 is capable of three times the computing performance of its predecessor. For highly complex or specialized tasks the hybrid or P-core monolithic architecture can be chosen for the best performance based on specific needs.

MXM GPU module
Type A and B MXM GPU modules allow comprehensive options to suit lightweight AI or high-performance AI inference applications. The special modular design also means painless upgrades to higher-end MXM modules to bolster performance in the future.

High-speed connections and data storage
Native 2.5GbE LAN and 20Gbps USB 3.2 Gen2x2 Type-C high-speed connections effectively improve the efficiency of image and file transfer. Storage options include two 2.5” HDD/SSD bays and options for high-speed NVMe SSD storage.

Ideal for mobility applications
Compact size (260 x 200 x 85 mm), multiple M.2 expansion slots for 5G of Wi-Fi communication modules, and compliance with rail transit certification (EN50121-3-2) and vehicle certification (E-mark) make the GM-1100 ideal for mobility applications.

Superior cooling performance
The innovative thermal design improves system cooling by providing independent heat dissipation channels for the CPU and GPU to the upper cover and sides of the extruded aluminum case. Combined with an external fan, it provides a solid foundation for stable and reliable operation.

Rugged safety
The harsh challenges of the Edge AI environment are overcome with industrial grade wide temperature (-40 to 70°C) and wide voltage (9 to 48 VDC) support, and passing the US military shock standard (MIL-STD-810H) to ensure product stability and safety.